Automated Fluid Dispensing & Bonding Solutions and Robots
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Shinwa provides high-speed and high-precision dispensing systems and robots for fluid application in electronics manufacturing and other industries.
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Their products are designed for applications such as die bonding, encapsulation, sealing, and potting. The systems offer a high level of accuracy and control for various manufacturing processes. QUSPA LX, QUSPA GP-2, QUSPA SP
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| 来源 | JP |